Problem Description

The problem considered is shown schematically in Figure  24.1. The configuration consists of a series of side-by-side electronic chips, or modules, mounted on a circuit board. Air flow, confined between the circuit board and an upper wall, cools the modules. To take advantage of the symmetry present in the problem, the model will extend from the middle of one module to the plane of symmetry between it and the next module.

As shown in the figure, each half-module is assumed to generate 2.0 Watts and to have a bulk conductivity of 1.0 W/m $^{2}$-K. The circuit board conductivity is assumed to be one order of magnitude lower: 0.1 W/m $^{2}$-K. The air flow enters the system at 298 K with a velocity of 1 m/s. The Reynolds number of the flow, based on the module height, is about 600. The flow is therefore treated as laminar.

Figure 24.1: Problem Specification